TPS2340A

SLUS528A – MARCH 2002 – REVISED AUGUST 2002

25

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PFP (S-PQFP-G80)

PowerPAD

 PLASTIC QUAD FLATPACK

40

Thermal Pad

(see Note D)

21

0,13 NOM

0,25

0,75

0,45

Seating Plane

4146925/A 01/98

Gage Plane

0,27

41

0,17

20

60

1

61

80

SQ

SQ

12,20

13,80

14,20

11,80

9,50 TYP

1,05

1,20 MAX

0,95

0,50

0,08

M

0,08

0

°–7°

0,15

0,05

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion.

D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane.

This pad is electrically and thermally connected to the backside of the die and possibly selected leads.

E. Falls within JEDEC MS-026