R5F52106ADFN datasheet(1/223 Pages) RENESAS

tên linh kiện	R5F52106ADFN

Giải thích chi tiết về linh kiện	50-MHz 32-bit RX MCUs, 78 DMIPS, up to 1-MB flash memory,

PDF	223 Pages

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Datasheet

R01DS0041EJ0150 Rev.1.50

Page 1 of 221

Oct 18, 2013

RX210 Group

Renesas MCUs

Features

■ 32-bit RX CPU core

 Max. operating frequency: 50 MHz

Capable of 78 DMIPS in operation at 50 MHz

 Accumulator handles 64-bit results (for a single instruction)

from 32- × 32-bit operations

 Multiplication and division unit handles 32- × 32-bit

operations (multiplication instructions take one CPU clock

cycle)

 Fast interrupt

 CISC Harvard architecture with 5-stage pipeline

 Variable-length instructions, ultra-compact code

 On-chip debugging circuit

■ Low power design and architecture

 Operation from a single 1.62-V to 5.5-V supply

 1.62-V operation available (at up to 20 MHz)

 Deep software standby mode with RTC remaining usable

 Four low power consumption modes

■ On-chip flash memory for code, no wait states

 50-MHz operation, 20-ns read cycle

 No wait states for reading at full CPU speed

 64-K to 1-Mbyte capacities

 User code programmable via the SCI

 Programmable at 1.62 V

 For instructions and operands

■ On-chip data flash memory

 8 Kbytes

(Number of times of reprogramming: 100,000)

 Erasing and programming impose no load on the CPU.

■ On-chip SRAM, no wait states

 12-K to 96-Kbyte size capacities

■ DMA

 DMAC: Incorporates four channels

 DTC: Four transfer modes

■ ELC

 Module operation can be initiated by event signals without

going through interrupts.

 Modules can operate while the CPU is sleeping.

■ Reset and supply management

 Nine types of reset, including the power-on reset (POR)

 Low voltage detection (LVD) with voltage settings

■ Clock functions

 Frequency of external clock: Up to 20 MHz

 Frequency of the oscillator for sub-clock generation: 32.768

kHz

 PLL circuit input: 4 MHz to 12.5 MHz

 On-chip low- and high-speed oscillators, dedicated on-chip

low-speed oscillator for the IWDT

 Generation of a dedicated 32.768-kHz clock for the RTC

 Clock frequency accuracy measurement circuit (CAC)

■ Realtime clock

 Adjustment functions (30 seconds, leap year, and error)

 Year and month display or 32-bit second display (binary

counter) is selectable

 Time capture function

 Time capture on event-signal input through external pins

 RTC capable of initiating return from deep software standby

mode

■ Independent watchdog timer

 125-kHz on-chip oscillator produces a dedicated clock signal

to drive IWDT operation.

■ Useful functions for IEC60730 compliance

 Self-diagnostic and disconnection-detection assistance

functions for the A/D converter, clock frequency accuracy

measurement circuit, independent watchdog timer, functions

to assist in RAM testing, etc.

■ Up to 15 communications channels

 SCI with many useful functions (up to 13 channels)

Asynchronous mode, clock synchronous mode, smart card

interface

 I2C bus interface: Transfer at up to 400 kbps, capable of

SMBus operation (one channel)

 RSPI (one channel): Transfer at up to 16 Mbps (768-Kbyte/

1-Mbyte flash memory or 144/145-pin products)

■ External address space

 Four CS areas (4 × 16 Mbytes)

 8- or 16-bit bus space is selectable per area

■ Up to 20 extended-function timers

 16-bit MTU: input capture, output compare, complementary

PWM output, phase counting mode

(six channels)

 16-bit TPU: input capture, output capture, phase counting

mode (six channels)

 8-bit TMR (four channels)

 16-bit compare-match timers (four channels)

■ 12-bit A/D converter

 Capable of conversion within 1 μs

 Sample-and-hold circuits (for three channels)

 Three-channel synchronized sampling available

 Self-diagnostic function and analog input disconnection

detection assistance function

■ 10-bit D/A converter

■ Analog comparator

■ General I/O ports

 5-V tolerant, open drain, input pull-up, switching of driving

ability

■ MPC

 Multiple locations are selectable for I/O pins of peripheral

functions

■ Temperature sensor

■ Operating temp. range

40C to +85C

40C to +105C

■ Applications

 69WLBGA (SWBG0069LA-A): General consumer

equipment

 Other than above package: General industrial and consumer

equipment

PLQP0144KA-A 20 × 20 mm, 0.5-mm pitch

PLQP0100KB-A 14 × 14 mm, 0.5-mm pitch

PLQP0080KB-A 12 × 12 mm, 0.5-mm pitch

PLQP0064KB-A 10 × 10 mm, 0.5-mm pitch

PLQP0048KB-A 7 × 7 mm, 0.5-mm pitch

PLQP0080JA-A 14 × 14 mm, 0.65-mm pitch

PLQP0064GA-A 14 × 14 mm, 0.8-mm pitch

PTLG0145KA-A 7 × 7 mm, 0.5-mm pitch

PTLG0100JA-A

7 × 7 mm, 0.65-mm pitch

PTLG0100KA-A 5.5 × 5.5 mm, 0.5-mm pitch

PTLG0064JA-A

6 × 6 mm, 0.65-mm pitch

SWBG0069LA-A 3.91 × 4.26mm,

0.40-mm pitch

50-MHz 32-bit RX MCUs, 78 DMIPS, up to 1-MB flash memory,

12-bit A/D, 10-bit D/A, ELC, MPC, RTC, up to 15 comms channels;

incorporating functions for IEC60730 compliance

R01DS0041EJ0150

Rev.1.50

Oct 18, 2013

Số phần tương tự - R5F52106ADFN

nhà sản xuất	tên linh kiện	bảng dữ liệu	Giải thích chi tiết về linh kiện
Renesas Technology Corp	R5F52106ADFN	782Kb / 92P	50-MHz 32-bit RX MCUs, 78 DMIPS, up to 512-KB flash memory, 12-bit AD, 10-bit DA
Renesas Technology Corp	R5F52106ADFN	1Mb / 146P	Renesas MCUs

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nhà sản xuất	tên linh kiện	bảng dữ liệu	Giải thích chi tiết về linh kiện
Renesas Technology Corp	R5F52108ADFP	782Kb / 92P	50-MHz 32-bit RX MCUs, 78 DMIPS, up to 512-KB flash memory, 12-bit AD, 10-bit DA
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	RX111	1,012Kb / 110P	32 MHz 32-bit RX MCUs, 50 DMIPS, up to 128 Kbytes of flash memory
	RX65N	1Mb / 190P	120-MHz, 32-bit RX MCU, on-chip FPU, 240 DMIPS, up to 1-MB flash memory,
	RX110	1Mb / 108P	32 MHz 32-bit RX MCUs, 50 DMIPS
	RX111	1Mb / 127P	32 MHz 32-bit RX MCUs, 50 DMIPS, up to 512 Kbytes of flash memory
	RX113	1Mb / 131P	32 MHz, 32-bit RX MCUs, 50 DMIPS, up to 512 Kbytes of flash memory
	RX130	1Mb / 116P	32-MHz, 32-bit RX MCUs, 50 DMIPS, up to 128-KB flash memory
	RX23E-A	1Mb / 98P	32-MHz, 32-bit RX MCUs with up to 256-KB flash memory,
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