Data Sheet

ADL9006

Rev. 0 | Page 5 of 14

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

Rating

8 V

−2.6 V to +3.6 V

RF Input Power (RFIN)

20 dBm

1.96 W

Maximum Peak Reflow Temperature,

Moisture Sensitivity Level 3 (MSL3)

260°C

Channel Temperature to Maintain 1,000,000

Hour Meant Time to Failure (MTTF)

175°C

Nominal Channel Temperature (T = 85°C,

98°C

Storage Temperature Range

−65°C to +150°C

Operating Temperature Range

−40°C to +85°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

Table 6. Thermal Resistance

Package

Unit

46

°C/W

1

conditions: the heat transfer is due solely to thermal conduction from the

channel, through the ground paddle, to the PCB, and the ground paddle is

held constant at the operating temperature of 85°C.

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of ESD

sensitive devices in an ESD protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

ESD Ratings for ADL9006

Table 7. ADL9006, 32-Lead LFCSP_CAV

ESD Model

Withstand Threshold (V)

Class

HBM

500

1B

ESD CAUTION