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Table 35. Flash command timing specifications for S32K14x series (continued)
Symbol
Description1
S32K142
S32K144
S32K146
S32K148
Typ
Max
Typ
Max
Typ
Max
Typ
Max
Unit Notes
128 KB flash —
—
—
—
—
—
—
—
256 KB flash —
2
—
—
—
—
—
—
512 KB flash —
—
—
1.8
—
2
—
2
trd1sec
Read 1 Section
execution time
2 KB flash
—
75
—
75
—
75
—
75
µs
4 KB flash
—
100
—
100
—
100
—
100
tpgmchk
Program Check
execution time
—
—
95
—
95
—
95
—
100
µs
tpgm8
Program Phrase
execution time
—
90
225
90
225
90
225
90
225
µs
tersblk
Erase Flash
Block execution
time
32 KB flash —
—
—
—
—
—
—
—
ms
2
64 KB flash 30
550
30
550
30
550
—
—
128 KB flash —
—
—
—
—
—
—
—
256 KB flash 250
2125
—
—
—
—
—
—
512 KB flash —
—
250
4250
250
4250
250
4250
tersscr
Erase Flash
Sector execution
time
—
12
130
12
130
12
130
12
130
ms
2
tpgmsec1k
Program Section
execution time
(1KB flash)
—
5
—
5
—
5
—
5
—
ms
trd1all
Read 1s All
Block execution
time
—
—
2.8
—
2.3
—
5.2
—
8.2
ms
trdonce
Read Once
execution time
—
—
30
—
30
—
30
—
30
µs
tpgmonce
Program Once
execution time
—
90
—
90
—
90
—
90
—
µs
tersall
Erase All Blocks
execution time
—
250
2800
400
4900
700
10000 1400
17000 ms
2
tvfykey
Verify Backdoor
Access Key
execution time
—
—
35
—
35
—
35
—
35
µs
tersallu
Erase All Blocks
Unsecure
execution time
—
250
2800
400
4900
700
10000 1400
17000 ms
2
tpgmpart
Program
Partition for
EEPROM
execution time
32 KB
EEPROM
backup
70
—
70
—
70
—
—
—
ms
3
64 KB
EEPROM
backup
71
—
71
—
71
—
150
—
tsetram
Set FlexRAM
Function
execution time
Control
Code 0xFF
0.08
—
0.08
—
0.08
—
0.08
—
ms
3
Table continues on the next page...
Memory and memory interfaces
S32K1xx Data Sheet, Rev. 12, 02/2020
NXP Semiconductors
43



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