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SL2S2602 bảng dữ liệu(PDF) 49 Page - NXP Semiconductors

tên linh kiện SL2S2602
Giải thích chi tiết về linh kiện  ICODE SLIX2
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nhà sản xuất  NXP [NXP Semiconductors]
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SL2S2602 bảng dữ liệu(HTML) 49 Page - NXP Semiconductors

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NXP Semiconductors
SL2S2602
ICODE SLIX2
SL2S2602
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2017. All rights reserved.
Product data sheet
Rev. 4.1 — 25 July 2017
COMPANY PUBLIC
276341
49 / 55
17 Revision history
Table 87. Revision history
Document ID
Release date
Data sheet status
Change
notice
Supersedes
SL2S2602 v. 4.1
20170725
Product data sheet
-
SL2S2602 v. 4.0
Modifications:
• Addition of SL2S2602FA8 with SOT500-4 (MOA8) package
• Addition of SL2S2602FTB with SOT1122 package
SL2S2602 v. 4.0
20160218
Product data sheet
-
SL2S2602 v. 3.2
Modifications:
• Changed ordering information to SL2S2602FUD/BG (with 7 μm Polyimide spacer)
• Added 7 μm Polyimide spacer to wafer specification
SL2S2602 v. 3.2
20150126
Product data sheet
-
SL2S2602_276331
Modifications:
• Editorial changes
SL2S2602_276331
20141210
Product data sheet
-
276330
Modifications:
• Security status changed into COMPANY PUBLIC
276330
20141118
Product data sheet
-
276311
Modifications:
• Data sheet status changed from objective to product
276311
20140528
Objective data sheet
-
276310
Modifications:
• Section 9.4 "State diagram" added
• Conditions added for STAY QUIETPERSITANT command in Section 9.5.3.19
• Modification of the QUIET and PERSISTANT QUIET bit in the extended mode of the
INVENTORY READ command in Table 47 "Extended options" and Table 48 "QUIET and
PERSISTANT QUIET bit in Extended options"
• Added remark for QUIET and PERSISTANT QUIET state in Section 9.5.3.15 "EAS
ALARM"
• Update of die dimensions in Section 8.1 "Wafer specification" and Section 14 "Bare die
outline"
• Editorial changing
276310
20131001
Objective data sheet
-
-
Modifications:
• Initial version



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