MT7697DIN datasheet(72/84 Pages) ETC2

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MT7697D

Internet-of-Things Wireless Connectivity

Page 72 of 84

This document contains information that is proprietary to MediaTek Inc. (“MediaTek”) and/or its licensor(s).

Any unauthorized use, reproduction or disclosure of this document in whole or in part is strictly prohibited.

4.7

Thermal Characteristics

ΘJC assumes that all the heat is dissipated through the top of the package, while ΨJt assumes that the

heat is dissipated through the top, sides, and the bottom of the package. Thus it is suggested to use

ΨJt to estimate the junction temperature.

Table 4-7. Thermal Characteristics

Symbol Description

Performance

Typical

Unit

Maximum Junction Temperature (Plastic Package)

125

°C

ΘJA

Junction to ambient temperature thermal resistance[1]

19.21

°C/W

ΘJC

Junction to case temperature thermal resistance

7.33

°C/W

ΨJt

Junction to the package thermal resistance[2]

1.65

°C/W

Note 1: JEDEC 51-7 system FR4 PCB size: 76.2mm x 114.3mm

Note 2: 8mm x 8mm QFN-68 package

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