SC16C554DB datasheet(49/51 Pages) PHILIPS

49 / 51 page

9397 750 13133

Product data sheet

Rev. 01 — 9 February 2005

49 of 51

Philips Semiconductors

SC16C554B/554DB

5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 16-byte FIFOs

[4]

These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the

solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink

on the top side, the solder might be deposited on the heatsink surface.

[5]

If wave soldering is considered, then the package must be placed at a 45

° angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[6]

Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is

deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[7]

Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger

than 0.65 mm; it is deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

[8]

Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered

pre-mounted on ﬂex foil. However, the image sensor package can be mounted by the client on a ﬂex foil by

using a hot bar soldering process. The appropriate soldering proﬁle can be provided on request.

[9]

Hot bar soldering or manual soldering is suitable for PMFP packages.

13. Abbreviations

14. Revision history

Table 28:

Abbreviations

Acronym

Description

CPU

Central Processing Unit

DMA

Direct Memory Access

FIFO

First In/First Out

ISDN

Integrated Service Digital Network

QUART

4-channel (Quad) Universal Asynchronous Receiver and Transmitter

UART

Universal Asynchronous Receiver and Transmitter

Table 29:

Revision history

Document ID

Release date

Data sheet status

Change notice

Doc. number

Supersedes

SC16C554B_554DB_1

20050209

Product data sheet

9397 750 13133

SC16C554DB bảng dữ liệu(PDF) 49 Page - NXP Semiconductors

SC16C554DB bảng dữ liệu(HTML) 49 Page - NXP Semiconductors

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51

bảng dữ liệu tải về

Link URL