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Application Support: Phone: 1-800-ANALOG-D

5

HMC409LP4E

v04.1217

GaAs InGaP HBT 1 WATT

POWER AMPLIFIER, 3.3 - 3.8 GHz

Outline Drawing

Absolute Maximum Ratings

Collector Bias Voltage (Vcc1, Vcc2)

+5.5 Vdc

Control Voltage (Vpd)

+5.5 Vdc

rf input power (rfin)(Vs = Vpd = +5Vdc)

+10 dBm

Junction Temperature

150 °C

Continuous pdiss (T = 85 °C)

(derate 57.5 mw/°C above 85 °C)

3.74 w

Thermal resistance

(junction to ground paddle)

17.4 °C/w

storage Temperature

-65 to +150 °C

operating Temperature

-40 to +85 °C

esD sensitivity (HBm)

Class 1A,

passed 250V

Vs (Vdc)

icq (mA)

4.75

516

5.0

615

5.25

721

Typical Supply, Current vs. Supply

Voltage, Vcc1 = Vcc2 = Vpd

part number

package Body material

lead finish

msl rating

HmC409lp4e

roHs-compliant low stress injection molded plastic

100% matte sn

msl3

[1]

H409

XXXX

[1] max peak reflow temperature of 260 °C

[2] 4-Digit lot number XXXX

Package Information

eleCTrosTATiC sensiTiVe DeViCe

oBserVe HAnDlinG preCAUTions

0.50

BSC

0.50

0.40

0.30

COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-8.

24-Lead Lead Frame Chip Scale Package [LFCSP]

4 x 4 mm Body and 0.85 mm Package Height

(CP-24-16)

Dimensions shown in millimeters

BOTTOM VIEW

TOP VIEW

4.10

4.00 SQ

3.90

0.90

0.85

0.80

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

PIN 1

INDICATOR

1

24

7

12

13

18

19

6

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.30

0.25

0.18

0.20 MIN

2.85

2.70 SQ

2.55

EXPOSED

PAD

SEATING

PLANE

PIN 1

INDICATOR AREA OPTIONS

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

24-lead lead frame Chip scale package [lfCsp]

4 mm × 4 mm Body and 0.85 mm package Height

(Cp-24-16)

Dimensions shown in millimeters.