MPC755 datasheet(53/56 Pages) MOTOROLA

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MPC755 RISC Microprocessor Hardware Specifications, Rev. 6.1

Freescale Semiconductor

Ordering Information

10.3 Part Marking

Parts are marked as the example shown in Figure 29.

Figure 29. Part Marking for BGA Device

Table 22. Part Numbers Addressed by XPC755BxxnnnLD Series Part Number Specification (Document Order No.

MPC755BLDPNS/D)

XPC

xxx

nnn

Product

Code

Part

Identifier

Process

Descriptor

Package

Processor

Frequency

Application Modifier

Revision Level

XPC

755

745

B = HiP4DP

PX = PBGA

RX = CBGA

300

350

400

L: 2.0 V ± 100 mV

0° to 105°C

D: 2.7; PVR = 0008 3203

Table 23. Part Numbers Addressed by XPC755xxxnnnLE Series Part Number Specification (Document Order No.

MPC755BLEPNS/D)

XPC

755

nnn

Product

Code

Part

Identifier

Process

Descriptor

Package

Processor

Frequency

Application Modifier

Revision Level

XPC

755

B = HiP4DP

RX = CBGA

400

L: 2.0 V ± 100 mV

0° to 105°C

E: 2.7; PVR = 0008 3203

PX = PBGA

C = HiP4DP

RX = CBGA

450

BGA

XPC755C

RX400LE

MMMMMM

ATWLYYWWA

755

BGA

XPC745B

RX350LE

MMMMMM

ATWLYYWWA

745

Notes:

CCCCC is the country of assembly. This space is left blank if parts are assembled in the United States.

MMMMMM is the 6-digit mask number.

ATWLYYWWA is the traceability code.

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