MB91F467BA datasheet(124/127 Pages) CYPRESS

124 / 127 page

MB91460B Series

Document Number: 002-04608 Rev. *A

Page 123 of 126

17. Package Dimension

144-pin plastic LQFP

Lead pitch

0.50 mm

Package width

package length

20.0

× 20.0 mm

Lead shape

Gullwing

Sealing method

Plastic mold

Mounting height

1.70 mm MAX

Weight

1.20g

Code

(Reference)

P-LFQFP144-20

×20-0.50

144-pin plastic LQFP

(FPT-144P-M08)

2003 FUJITSU LIMITED F144019S-c-4-6

Details of "A" part

0.25(.010)

(Stand off)

(.004±.004)

0.10±0.10

(.024±.006)

0.60±0.15

(.020±.008)

0.50±0.20

1.50

+0.20

–0.10

+.008

–.004

.059

0˚~8˚

0.50(.020)

"A"

0.08(.003)

0.145±0.055

(.006±.002)

LEAD No. 1

INDEX

108

109

144

0.22±0.05

(.009±.002)

0.08(.003)

20.00±0.10(.787±.004)SQ

22.00±0.20(.866±.008)SQ

(Mounting height)

Dimensions in mm (inches).

Note: The values in parentheses are reference values.

Note 1) *:Values do not include resin protrusion.

Resin protrusion is +0.25(.010)Max(each side).

Note 2) Pins width and pins thickness include plating thickness.

Note 3) Pins width do not include tie bar cutting remainder.

MB91F467BA bảng dữ liệu(PDF) 124 Page - Cypress Semiconductor

MB91F467BA bảng dữ liệu(HTML) 124 Page - Cypress Semiconductor

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

bảng dữ liệu tải về

Link URL