Molded Guide

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Vishay Polytech

Revision: 11-Apr-16

7

Document Number: 40218

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

GUIDE TO APPLICATION

1.

AC Ripple Current: the maximum allowable ripple

current shall be determined from the formula:

where,

P =

power dissipation in W at +25 °C as given in

the tables in the product datasheets.

the specified frequency.

2.

AC Ripple Voltage: the maximum allowable ripple

voltage shall be determined from the formula:

or, from the formula:

where,

P =

power dissipation in W at +25 °C as given in

the tables in the product datasheets.

the specified frequency.

Z =

The capacitor impedance at the specified

frequency.

2.1

The tantalum capacitors must be used in such a

condition that the sum of the working voltage and

ripple voltage peak values does not exceed the rated

voltage as shown in figure below.

3.

Temperature

Derating:

power

dissipation

is

affected by the heat sinking capability of the

mounting surface. If

these capacitors

are to

be operated at temperatures above +25 °C, the

permissible ripple current (or voltage) shall be

calculated using the derating coefficient as shown in

the table below:

4.

Reverse Voltage: the capacitors are not intended for

use with reverse voltage applied. If the application of

an reverse voltage is unavoidable, it must not exceed

the following values:

At 25 °C: 10 % of the rated voltage or 1 V, whichever

is smaller.

At 85 °C: 5 % of the rated voltage or 0.5 V, whichever

is smaller.

5.

Mounting Precautions:

5.1

Limit Pressure on Capacitor Installation with

Mounter: pressure must not exceed 4.9 N with a tool

end diameter of 1.5 mm when applied to the

capacitors using an absorber, centering tweezers, or

similar (maximum permitted pressurization time: 5 s).

An excessively low absorber setting position would

result in not only the application of undue force to the

capacitors but capacitor and other component

scattering, circuit board wiring breakage, and / or

cracking as well, particularly when the capacitors are

mounted together with other chips having a height of

1 mm or less.

5.2

Flux Selection

5.2.1

Select a flux that contains a minimum of chlorine and

amine.

5.2.2

After flux use, the chlorine and amine in the flux

remain must be removed.

5.3

Cleaning After Mounting: the following solvents are

usable when cleaning the capacitors after mounting.

Never use a highly active solvent.

• Halogen organic solvent (HCFC225, etc.)

• Alcoholic solvent (IPA, ethanol, etc.)

• Petroleum solvent, alkali saponifying agent, water,

etc.

Circuit board cleaning must be conducted at a

temperature of not higher than 50 °C and for an

immersion time of not longer than 30 minutes. When

an ultrasonic cleaning method is used, cleaning must

be conducted at a frequency of 48 kHz or lower, at

not higher than 40 °C, and for a time of 5 minutes or

shorter.

Notes

• Care must be exercised in cleaning process so that the

mounted capacitor will not come into contact with any

cleaned object or the like or will not get rubbed by a stiff

brush or similar. If such precautions are not taken

particularly when the ultrasonic cleaning method is

employed, terminal breakage may occur.

• When performing ultrasonic cleaning under conditions

other than stated above, conduct adequate advance

checkout.

MAXIMUM RIPPLE CURRENT TEMPERATURE

DERATING FACTOR

TEMPERATURE

TMC

NMC

 25 °C

1.0

1.0

85 °C

0.9

0.9

105 °C

0.65

0.4

125 °C

0.4

-

I

RM S

P

R

ESR

------------

=

V

RM S

Z

P

R

ESR

------------

=

V

RMS

I

RM S

x

Z

=

Rated voltage

Ripple voltage

Operating

voltage

Working voltage

Time (s)