TMCP datasheet(10/12 Pages) VISHAY

10 / 12 page

Molded Guide

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Vishay Polytech

Revision: 11-Apr-16

Document Number: 40218

For technical questions, contact: tantalum@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

RECOMMENDED REFLOW PROFILES

Capacitors should withstand reflow profile as per J-STD-020 standard

PROFILE FEATURE

LEAD (Pb)-FREE ASSEMBLY

Preheat / soak

Temperature min. (Ts min.)

130 °C

Temperature max. (Ts max.)

160 °C

Time (ts) from (Ts min. to Ts max.)

60 s to 120 s

Ramp-up

Ramp-up rate (TL to Tp)

3 °C/s max.

Liquidus temperature (TL)

200 °C

Time (tL) maintained above TL

50 s max.

Peak package body temperature (Tp) max.

Depends on case size - see table below

Time (tp) within 5 °C of the peak maximum temperature

10 s max.

Ramp-down rate (Tp to TL)

6 °C/s max.

Time from 25 °C to peak temperature

8 min max.

PEAK PACKAGE BODY TEMPERATURE (Tp)

CASE CODE

PEAK PACKAGE BODY TEMPERATURE (Tp)

LEAD (Pb)-FREE PROCESS

J, P, UA, A, UB, B, C

260 °C

E, F

250 °C

PAD DIMENSIONS in millimeters

CASE /

DIMENSIONS

CAPACITOR SIZE

PAD DIMENSIONS

G (max.)

Z (min.)

X (min.)

Y (Ref.)

1.6

0.8

0.7

2.5

1.0

0.9

2.0

1.25

0.5

2.6

1.2

1.05

UA, A

3.2

1.6

1.1

3.8

1.5

1.35

UB, B

3.5

2.8

1.4

4.1

2.7

1.35

5.8

3.2

2.9

6.9

2.7

2.0

7.3

4.3

4.1

8.2

2.9

2.05

7.3

5.8

4.1

8.2

4.0

2.05

TIME (s)

Time 25 °C to peak

C - 5 °C

s max.

s min.

Preheat area

Max. ramp-up rate = 3 °C/s

Max. ramp-down rate = 6 °C/s

Capacitor

Pattern

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