AD9628 datasheet(13/43 Pages) AD

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AD9628

Data Sheet

Rev. C | Page 12 of 42

ABSOLUTE MAXIMUM RATINGS

Table 6.

Parameter

Rating

Electrical

AVDD to AGND

−0.3 V to +2.0 V

DRVDD to AGND

−0.3 V to +2.0 V

VIN+A/VIN+B, VIN−A/VIN−B to AGND

−0.3 V to AVDD + 0.2 V

CLK+, CLK− to AGND

−0.3 V to AVDD + 0.2 V

SYNC to DRVDD

−0.3 V to AVDD + 0.2 V

VCM to AGND

−0.3 V to AVDD + 0.2 V

RBIAS to AGND

−0.3 V to AVDD + 0.2 V

CSB to AGND

−0.3 V to DRVDD + 0.2 V

SCLK/DFS to AGND

−0.3 V to DRVDD + 0.2 V

SDIO/DCS to AGND

−0.3 V to DRVDD + 0.2 V

OEB

−0.3 V to DRVDD + 0.2 V

PDWN

−0.3 V to DRVDD + 0.2 V

D0A/D0B through D11A/D11B to

AGND

−0.3 V to DRVDD + 0.2 V

DCOA/DCOB to AGND

−0.3 V to DRVDD + 0.2 V

Environmental

Operating Temperature Range

(Ambient)

−40°C to +85°C

Maximum Junction Temperature

Under Bias

150°C

Storage Temperature Range

(Ambient)

−65°C to +150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL CHARACTERISTICS

The exposed paddle must be soldered to the ground plane for

the LFCSP package. Soldering the exposed paddle to the printed

circuit board (PCB) increases the reliability of the solder joints

and maximizes the thermal capability of the package.

Table 7. Thermal Resistance

Package Type

Airflow

Velocity

(m/sec)

θJA1,2

θJC1,3

θJB1,4



1, 2

Unit

64-Lead LFCSP

9 mm × 9 mm

(CP-64-4)

22.3

1.4

11.8

0.1

°C/W

1.0

19.5

N/A5

0.2

°C/W

2.5

17.5

N/A5

0.2

°C/W

1 Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.

2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).

3 Per MIL-Std 883, Method 1012.1.

4 Per JEDEC JESD51-8 (still air).

5 N/A means not applicable.

Typical θJA is specified for a 4-layer PCB with a solid ground

plane. As shown Table 7, airflow improves heat dissipation,

which reduces θJA. In addition, metal in direct contact with the

package leads from metal traces, through holes, ground, and

power planes reduces θJA.

ESD CAUTION

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