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STM32F070CB bảng dữ liệu(PDF) 52 Page - STMicroelectronics |
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STM32F070CB bảng dữ liệu(HTML) 52 Page - STMicroelectronics |
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52 / 83 page ![]() Electrical characteristics STM32F070CB/RB/C6/F6 52/83 DocID027114 Rev 3 6.3.11 EMC characteristics Susceptibility tests are performed on a sample basis during device characterization. Functional EMS (electromagnetic susceptibility) While a simple application is executed on the device (toggling 2 LEDs through I/O ports). the device is stressed by two electromagnetic events until a failure occurs. The failure is indicated by the LEDs: • Electrostatic discharge (ESD) (positive and negative) is applied to all device pins until a functional disturbance occurs. This test is compliant with the IEC 61000-4-2 standard. • FTB: A Burst of Fast Transient voltage (positive and negative) is applied to VDD and VSS through a 100 pF capacitor, until a functional disturbance occurs. This test is compliant with the IEC 61000-4-4 standard. A device reset allows normal operations to be resumed. The test results are given in Table 40. They are based on the EMS levels and classes defined in application note AN1709. Designing hardened software to avoid noise problems EMC characterization and optimization are performed at component level with a typical application environment and simplified MCU software. It should be noted that good EMC performance is highly dependent on the user application and the software in particular. Therefore it is recommended that the user applies EMC software optimization and prequalification tests in relation with the EMC level requested for his application. Software recommendations Table 39. Flash memory endurance and data retention Symbol Parameter Conditions Min(1) 1. Data based on characterization results, not tested in production. Unit NEND Endurance TA = -40 to +85 °C 1 kcycle tRET Data retention 1 kcycle(2) at TA = 85 °C 2. Cycling performed over the whole temperature range. 20 Years Table 40. EMS characteristics Symbol Parameter Conditions Level/ Class VFESD Voltage limits to be applied on any I/O pin to induce a functional disturbance VDD = 3.3V, LQFP48, TA = +25 °C, fHCLK = 48 MHz, conforming to IEC 61000-4-2 3B VEFTB Fast transient voltage burst limits to be applied through 100 pF on VDD and VSS pins to induce a functional disturbance VDD = 3.3V, LQFP48, TA = +25°C, fHCLK = 48 MHz, conforming to IEC 61000-4-4 4B |
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