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STM8TL52X4 bảng dữ liệu(PDF) 71 Page - STMicroelectronics |
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STM8TL52X4 bảng dữ liệu(HTML) 71 Page - STMicroelectronics |
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71 / 84 page ![]() DocID022344 Rev 7 71/84 STM8TL52x4 STM8TL53x4 Package information 79 10 Package information 10.1 ECOPACK® In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at:www.st.com. ECOPACK® is an ST trademark. 10.2 UFQFPN48 package information Figure 31. UFQFPN48 - 48-lead, 7x7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package outline 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this back-side pad to PCB ground. |
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