SPC560P34L1 datasheet(53/103 Pages) STMICROELECTRONICS

53 / 103 page

SPC560P34L1, SPC560P34L3, SPC560P40L1, SPC560P40L3

Electrical characteristics

Doc ID 16100 Rev 7

53/103

Equation 2: RθJA = RθJC + RθCA

where:

RθJA = junction-to-ambient thermal resistance (°C/W)

RθJC = junction-to-case thermal resistance (°C/W)

RθCA = case-to-ambient thermal resistance (°C/W)

RθJC is device related and cannot be influenced by the user. The user controls the thermal

environment to change the case-to-ambient thermal resistance, RθCA. For instance, the

user can change the size of the heat sink, the air flow around the device, the interface

material, the mounting arrangement on printed circuit board, or change the thermal

dissipation on the printed circuit board surrounding the device.

To determine the junction temperature of the device in the application when heat sinks are

not used, the Thermal Characterization Parameter (

ΨJT) can be used to determine the

junction temperature with a measurement of the temperature at the top center of the

package case using Equation 3:

Equation 3: TJ = TT + (ΨJT x PD)

where:

TT = thermocouple temperature on top of the package (°C)

ΨJT = thermal characterization parameter (°C/W)

PD = power dissipation in the package (W)

The thermal characterization parameter is measured per JESD51-2 specification using a 40

gauge type T thermocouple epoxied to the top center of the package case. The

thermocouple should be positioned so that the thermocouple junction rests on the package.

A small amount of epoxy is placed over the thermocouple junction and over about 1 mm of

wire extending from the junction. The thermocouple wire is placed flat against the package

case to avoid measurement errors caused by cooling effects of the thermocouple wire.

References:

●

Semiconductor Equipment and Materials International

3081 Zanker Road

San Jose, CA 95134U.S.A.

(408) 943-6900

●

MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global

Engineering Documents at (800) 854-7179 or (303) 397-7956.

●

JEDEC specifications are available on the WEB at http://www.jedec.org.

●

C.E. Triplett and B. Joiner, An Experimental Characterization of a 272 PBGA Within an

Automotive Engine Controller Module, Proceedings of SemiTherm, San Diego, 1998,

pp. 47–54.

●

G. Kromann, S. Shidore, and S. Addison, Thermal Modeling of a PBGA for Air-Cooled

Applications, Electronic Packaging and Production, pp. 53–58, March 1998.

●

B. Joiner and V. Adams, Measurement and Simulation of Junction to Board Thermal

Resistance and Its Application in Thermal Modeling, Proceedings of SemiTherm, San

Diego, 1999, pp. 212–220.

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