ADF4355BCPZ datasheet(36/36 Pages) AD

36 / 36 page

Data Sheet

ADF4355

Rev. A | Page 35 of 35

OUTLINE DIMENSIONS

0.50

BSC

BOTTOM VIEW

TOP VIEW

PIN 1

INDICATOR

EXPOSED

PAD

PIN 1

INDICATOR

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

0.30

0.25

0.18

5.10

5.00 SQ

4.90

0.80

0.75

0.70

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.50

0.40

0.30

0.25 MIN

*3.75

3.60 SQ

3.55

*COMPLIANT TO JEDEC STANDARDS MO-220-WHHD-5

WITH THE EXCEPTION OF THE EXPOSED PAD DIMENSION.

Figure 47. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

5 mm × 5 mm Body, Very, Very Thin Quad

(CP-32-12)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

ADF4355BCPZ

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

CP-32-12

ADF4355BCPZ-RL7

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

CP-32-12

EV-ADF4355SD1Z

Evaluation Board

Z = RoHS Compliant Part.

registered trademarks are the property of their respective owners.

D12910-0-3/16(A)

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