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MIC2128 bảng dữ liệu(PDF) 24 Page - Microchip Technology |
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MIC2128 bảng dữ liệu(HTML) 24 Page - Microchip Technology |
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24 / 32 page ![]() MIC2128 DS20005620A-page 24 2016 Microchip Technology Inc. FIGURE 5-7: Invisible Ripple at FB. The injected ripple at the FB pin in this case is given by the Equation 5-28:. EQUATION 5-28: In the above Equation 5-28, it is assumed that the time constant associated with the CFF meets the criteria shown in Equation 5-29. EQUATION 5-29: The process of sizing the ripple injection resistor and capacitors is: 1. Select CINJ in the range of 47 nF to 100 nF, which can be considered as short for a wide range of the frequencies. 2. Select CFF in the range of 0.47 nF to 10 nF, if R1 and R2 are in k range. 3. Select RINJ according to Equation 5-30. EQUATION 5-30: Once all the ripple injection component values are cal- culated, ensure that the criteria shown in the Equation 5-29 is met. 5.9 Power Dissipation in MIC2128 The MIC2128 features two Low Dropout Regulators (LDOs) to supply power at the PVDD pin from either VIN or EXTVDD depending on the voltage at the EXTVDD pin. PVDD powers MOSFET drivers and VDD pin, which is recommended to connect to PVDD through a low pass filter, powers the internal circuitry. In the applica- tions where the output voltage is 5V and above (up to 14V), it is recommended to connect EXTVDD to the output to reduce the power dissipation in the MIC2128, to reduce the MIC2128 junction temperature and to improve the system efficiency. The power dissipation in the MIC2128 depends on the internal LDO being in use, gate charge of the external MOSFETs and switching frequency. The power dissi- pation and the junction temperature of the MIC2128 can be estimated using the Equation 5-31, Equation 5-32 and Equation 5-33. Power dissipation in the MIC2128 when EXTVDD is not used: EQUATION 5-31: Power dissipation in the MIC2128 when EXTVDD is used: EQUATION 5-32: The junction temperature of the MIC2128 can be esti- mated using Equation 5-33. MIC2128 L R1 R2 COUT ESR CFF RINJ CINJ SW FB V FB PP V OUT 1 D – C FF R INJ f SW ------------------------------------------ = T SW C FF R 1 R2 RINJ R INJ V OUT 1D – C FF f SW V FB PP ------------------------------------------------------- = Where: VOUT = Output voltage D = Duty cycle fSW = Switching frequency VFB(pp) = Feedback Ripple P IC V IN I SW I Q + = P IC V EXTVDD I SW I Q + = I SW Q G f SW = Q G Q G_HS Q G_LS + = Where: ISW = Switching current into the VIN pin IQ = Quiescent current (1.4 mA typ) QG = Total gate charge of the external MOS- FETs which is sum of the gate charge of high-side MOSFET (QG_HS) and the low-side MOSFET (QG_LS) at 5V gate to source voltage. Gate charge information can be obtained from the MOSFETs datasheet. VEXTVDD = Voltage at the EXTVDD pin (4.6 ≤ VEXTVDD ≤ 14 V typ.) |
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