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CAP1114 bảng dữ liệu(PDF) 15 Page - Microchip Technology |
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CAP1114 bảng dữ liệu(HTML) 15 Page - Microchip Technology |
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15 / 102 page ![]() Multiple Channel Capacitive Touch Sensor and LED Driver Datasheet SMSC CAP1114 15 Revision 1.1 (02-04-11) DATASHEET Chapter 3 Electrical Specifications Note: Stresses above those listed could cause permanent damage to the device. This is a stress rating only and functional operation of the device at any other condition above those indicated in the operation sections of this specification is not implied. Note 3.1 For the 5V tolerant pins that have a pull-up resistor, the pull-up voltage must not exceed 3.6V when the device is unpowered. Note 3.2 The Package Power Dissipation specification assumes a thermal via design with the thermal landing be soldered to the PCB ground plane with 0.3mm (12mil) diameter vias in a 4x4 matrix at 0.9mm (35.4mil) pitch. Note 3.3 Junction to Ambient ( θJA) is dependent on the design of the thermal vias. Without thermal vias and a thermal landing, the θJA is approximately 60°C/W including localized PCB temperature increase. Table 3.1 Absolute Maximum Ratings Voltage on VDD pin -0.3 to 4 V Voltage on 5V tolerant pins (V5VT_PIN) -0.3 to 5.5 V Voltage on 5V tolerant pins (|V5VT_PIN - VDD|) (see Note 3.1)0 to 3.6 V Voltage on any other pin to GND -0.3 to VDD + 0.3 V Package Power Dissipation up to TA = 85°C (see Note 3.2)1 W Junction to Ambient ( θJA) (see Note 3.3)48 °C/W Operating Ambient Temperature Range -40 to 125 °C Storage Temperature Range -55 to 150 °C ESD Rating, All Pins, HBM 8000 V Table 3.2 Electrical Specifications VDD = 3V to 3.6V, TA = -40°C to 125°C, all Typical values at TA = 27°C unless otherwise noted. CHARACTERISTIC SYMBOL MIN TYP MAX UNIT CONDITIONS DC Power Supply Voltage VDD 3.0 3.3 3.6 V Supply Current IDD 0.55 1 mA Average current Capacitive Sensing Active, LEDs enabled ISLEEP 200 250 uA Sleep state active, 1 sensor monitored; LED11 inactive TA < 85°C IDSLEEP 4.5 10 uA Deep Sleep, LED 11 inactive TA < 40°C Time to Communications tCOMM 15 20 ms Time from power applied to communications active |
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