LP3907SQ-PFX6WSLASHNOPB datasheet(7/58 Pages) TI1

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LP3907

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SNVS511S – JUNE 2007 – REVISED APRIL 2016

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(1)

Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power

dissipation exists, special care must be paid to thermal dissipation issues in board design.

(2)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 160°C (typical) and

disengages at TJ = 140°C (typical)

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the

part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP − (RθJA × PD-MAX).

(4)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

7.4 Thermal Information

See

(1) (2) (3)

THERMAL METRIC(4)

LP3907

UNIT

RTW

YZR

24 PINS

25 PINS

RθJA

Junction-to-ambient thermal resistance

32.7

58.7

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

31.2

0.3

°C/W

RθJB

Junction-to-board thermal resistance

11.2

8.0

°C/W

ψJT

Junction-to-top characterization parameter

0.2

0.6

°C/W

ψJB

Junction-to-board characterization parameter

11.2

8.0

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

1.4

N/A

°C/W

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

This specification is ensured by design.

(4)

VPOR is voltage at which the EPROM resets. This is different from the UVLO on VINLDO12, which is the voltage at which the

regulators shut off, and is also different from the nPOR function, which signals if the regulators are in a specified range.

7.5

General Electrical Characteristics

Unless otherwise noted, VIN = 3.6 V and TJ = 25°C.

(1) (2) (3) (4)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

VINLDO12 shutdown current

VIN = 3.6 V

µA

VPOR

Power-on reset threshold

VDD falling edge

(4)

1.9

TSD

Thermal shutdown threshold

160

°C

TSDH

Thermal shutdown hysteresis

°C

UVLO

Undervoltage lockout

Rising

2.9

Falling

2.7

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