B2

B1

A1

A2

Power Ground

LP5907UV

18

LP5907

SNVS798J – APRIL 2012 – REVISED MARCH 2016

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Layout Examples (continued)

Figure 26. LP5907UV-x.x (DSBGA) Typical Layout

10.3 X2SON Mounting

The X2SON package thermal pad must be soldered to the printed circuit board for proper thermal and

mechanical performance. For more information, see the Application Report QFN/SON PCB Attachment

(SLUA271).

10.4 DSBGA Mounting

The DSBGA package requires specific mounting techniques, which are detailed in AN-1112 DSBGA Wafer Level

Chip Scale Package (SNVA009). For best results during assembly, alignment ordinals on the PC board may be

used to facilitate placement of the DSBGA device.

10.5 DSBGA Light Sensitivity

Exposing the DSBGA device to direct light may cause incorrect operation of the device. Light sources such as

halogen lamps can affect electrical performance if they are situated in proximity to the device. Light with

wavelengths in the red and infrared part of the spectrum have the most detrimental effect; thus, the fluorescent

lighting used inside most buildings has very little effect on performance.