DLPC900ZPC datasheet(63/72 Pages) TI1

tên linh kiện	DLPC900ZPC

Giải thích chi tiết về linh kiện	Digital Controller for Advanced Light Control

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DLPC900

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DLPS037A – OCTOBER 2014 – REVISED AUGUST 2015

10.2 Layout Example

The DLP® LightCrafter™ 9000 EVM PCB is targeted at 14 layers with layer stack up shown in Figure 32. The

PCB layer stack may vary depending on system design. However, careful attention is required to meet design

considerations. Layers 1 and 14 should consist of the components layers. Layers 2, 4, 6, 9, 11,and 13 should

consist of solid ground planes. Layers 7 and 8 should consist of solid power planes. Layers 1, 3, 5, 10, 12, and

14 should be used as the primary routing layers. Routing on external layers should be less than 0.25 inches for

priority one and two signals. Refer to the Table 21 for signal priority groups. Board material should be FR-370HR

or similar. PCB should be designed for lead-free assembly with the stackup geometry shown in Figure 32 and

Figure 33.

Figure 32. Board Layer Stack

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