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PIC16F628-20/SS bảng dữ liệu(PDF) 148 Page - Microchip Technology

tên linh kiện PIC16F628-20/SS
Giải thích chi tiết về linh kiện  FLASH-Based 8-Bit CMOS Microcontrollers
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nhà sản xuất  MICROCHIP [Microchip Technology]
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PIC16F628-20/SS bảng dữ liệu(HTML) 148 Page - Microchip Technology

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PIC16F62X
DS40300B-page 148
Preliminary
© 1999 Microchip Technology Inc.
Package Type:
K04-007 18-Lead Plastic Dual In-line (P) – 300 mil
* Controlling Parameter.
† Dimension “B1” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B1.”
‡ Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
Units
INCHES*
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
PCB Row Spacing
0.300
7.62
Number of Pins
n
18
18
Pitch
p
0.100
2.54
Lower Lead Width
B
0.013
0.018
0.023
0.33
0.46
0.58
Upper Lead Width
B1†
0.055
0.060
0.065
1.40
1.52
1.65
Shoulder Radius
R
0.000
0.005
0.010
0.00
0.13
0.25
Lead Thickness
c
0.005
0.010
0.015
0.13
0.25
0.38
Top to Seating Plane
A
0.110
0.155
0.155
2.79
3.94
3.94
Top of Lead to Seating Plane
A1
0.075
0.095
0.115
1.91
2.41
2.92
Base to Seating Plane
A2
0.000
0.020
0.020
0.00
0.51
0.51
Tip to Seating Plane
L
0.125
0.130
0.135
3.18
3.30
3.43
Package Length
D‡
0.890
0.895
0.900
22.61
22.73
22.86
Molded Package Width
E‡
0.245
0.255
0.265
6.22
6.48
6.73
Radius to Radius Width
E1
0.230
0.250
0.270
5.84
6.35
6.86
Overall Row Spacing
eB
0.310
0.349
0.387
7.87
8.85
9.83
Mold Draft Angle Top
α
5
10
15
5
10
15
Mold Draft Angle Bottom
β
5
10
15
5
10
15
R
n
2
1
D
E
c
eB
β
E1
α
p
A1
L
B1
B
A
A2



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