PIC16F628-20SLASHSS datasheet(147/160 Pages) MICROCHIP

147 / 160 page

Preliminary

DS40300B-page 147

PIC16F62X

19.0

PACKAGING INFORMATION

19.1

Package Marking Information

20-Lead SSOP

XXXXXXXXXX

AABBCDE

XXXXXXXXXX

18-Lead SOIC (.300")

XXXXXXXXXXXX

AABBCDE

XXXXXXXXXXXX

XXXXXXXXXXXXXXXXX

AABBCDE

18-Lead PDIP

Example

-04I / 218

9951 CBP

PIC16F627

Example

-04I / S0218

9918 CDK

PIC16F627

-04I / P456

9923 CBA

Example

Legend: MM...M

Microchip part number information

XX...X

Customer specific information*

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

Facility code of the plant at which wafer is manufactured

O = Outside Vendor

C = 5” Line

S = 6” Line

H = 8” Line

Mask revision number

Assembly code of the plant or country of origin in which

part was assembled

Note:

In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line thus limiting the number of available characters

for customer specific information.

Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask

rev#, and assembly code. For OTP marking beyond this, certain price adders apply. Please check with

your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price.

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