PIC16C72-04SLASHSP datasheet(109/124 Pages) MICROCHIP

109 / 124 page

PIC16C72 Series

Preliminary

DS39016A-page 109

16.0

PACKAGING INFORMATION

16.1

Package Marking Information

In the event the full Microchip part number cannot be marked on one

line, it will be carried over to the next line thus limiting the number of

available characters for customer speciﬁc information.

Note:

Standard OTP marking consists of Microchip part number, year code, week code,

facility code, mask revision number, and assembly code. For OTP marking beyond

this, certain price adders apply. Please check with your Microchip Sales Ofﬁce.

For QTP devices, any special marking adders are included in QTP price.

AABBCAE

XXXXXXXXXXXX

28-Lead SSOP

9517SBP

20I/SS025

PIC16C72

Example

28-Lead SOIC

XXXXXXXXXXXXXXXXXXXX

AABBCDE

MMMMMMMMMMMMMMMM

Example

945/CAA

PIC16C72-04/SO

XXXXXXXXXXXXXXX

AABBCDE

28-Lead PDIP (Skinny DIP)

MMMMMMMMMMMM

AABBCDE

Example

PIC16C72-04/SP

Example

28-Lead Side Brazed Skinny Windowed

XXXXXXXXXXX

AABBCDE

PIC16C72/JW

9517CAT

Legend: MM...M

Microchip part number information

XX...X

Customer speciﬁc information*

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

Facility code of the plant at which wafer is manufactured

O = Outside Vendor

C = 5” Line

S = 6” Line

H = 8” Line

Mask revision number

Assembly code of the plant or country of origin in which

part was assembled

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