UPD70F3003A datasheet(38/44 Pages) NEC

38 / 44 page

µPD70F3003A, 70F3025A

Data Sheet U13189EJ3V0DS00

5. RECOMMENDED SOLDERING CONDITIONS

Solder this product under the following recommended conditions.

For details of the recommended soldering conditions, refer to information document Semiconductor Device

Mounting Technology Manual (C10535E).

For soldering methods and conditions other than those recommended, consult NEC.

Table 5-1. Soldering Conditions

µPD70F3003AGC-25-8EU : 100-pin plastic LQFP (fine pitch) (14 × 14 mm)

µPD70F3003AGC-33-8EU : 100-pin plastic LQFP (fine pitch) (14 × 14 mm)

µPD70F3025AGC-25-8EU : 100-pin plastic LQFP (fine pitch) (14 × 14 mm)

µPD70F3025AGC-33-8EU : 100-pin plastic LQFP (fine pitch) (14 × 14 mm)

Soldering Method

Soldering Condition

Symbol of Recommended

Soldering Condition

Infrared reflow

Package peak temperature: 235

°C, Time: 30 seconds max.

IR35-103-3

(210

°C min.), Number of times: 3 max., Number of days:

3Note (after that, prebaking is necessary at 125

°C

for 10 hours.)

VPS

Package peak temperature: 215

°C, Time: 40 seconds max.

VP15-103-3

(200

°C min.), Number of times: 3 max., Number of days:

3Note (after that, prebaking is necessary at 125

°C

for 10 hours.)

Partial heating

Pin temperature: 300

°C max., Time: 3 seconds max. (per

—

side of device)

Note

The number of days for storage at 25

°C, 65% RH MAX after the dry pack has been opened.

Caution

Do not use two or more soldering methods in combination (except partial heating method).

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