UPD703003A datasheet(37/40 Pages) NEC

37 / 40 page

µPD703003A, 703004A, 703025A

Data Sheet U13188EJ4V0DS00

Package peak temperature: 235

°C, Time: 30 seconds max. (at 210°C or

higher), Count: Two times or less, Exposure limit: 7 daysNote (after that,

prebake at 125

°C for 10 hours)

Package peak temperature: 215

°C, Time: 40 seconds max. (at 200°C or

higher), Count: Two times or less, Exposure limit: 7 daysNote (after that,

prebake at 125

°C for 10 hours)

Pin temperature: 300

°C max., Time 3 seconds max. (per pin row)

5. RECOMMENDED SOLDERING CONDITIONS

The

µPD703003A, 703004A, and 703025A should be soldered and mounted under the following recommended

conditions.

For the details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting

Technology Manual (C10535E).

For soldering methods and conditions other than those recommended below, contact your NEC sales represen-

tatives.

Table 5-1. Soldering Conditions

µPD703003AGC-25-xxx-8EU: 100-pin plastic LQFP (fine pitch) (14 × 14 mm)

µPD703003AGC-33-xxx-8EU: 100-pin plastic LQFP (fine pitch) (14 × 14 mm)

µPD703004AGC-25-xxx-8EU: 100-pin plastic LQFP (fine pitch) (14 × 14 mm)

µPD703004AGC-33-xxx-8EU: 100-pin plastic LQFP (fine pitch) (14 × 14 mm)

µPD703025AGC-25-xxx-8EU: 100-pin plastic LQFP (fine pitch) (14 × 14 mm)

µPD703025AGC-33-xxx-8EU: 100-pin plastic LQFP (fine pitch) (14 × 14 mm)

Soldering Method

Soldering Conditions

Recommended

Condition Symbol

Infrared reflow

IR35-107-2

VPS

VP15-107-2

Partial heating

—

Note After opening a dry pack, store it at 25

°C or less and 65% RH or less for the allowable storage period.

Caution Do not use different soldering methods together (except for partial heating).

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