AN2836 datasheet(29/57 Pages) STMICROELECTRONICS

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AN2836

Designing an application with L6225, L6226, L6227

Doc ID 15084 Rev 1

29/57

4.15

Paralleling two full bridges

4.15.1

Paralleling two full bridges to get a single full bridge

The outputs of L6225, L6226, L6227 can be paralleled to increase the output current

capability or reduce the power dissipation in the device at a given current level. It must be

noted, however, that the internal wire bond connections from the die to the power or sense

pins of the package must carry current in both of the associated half bridges (see Figure 29

and 30). When the two halves of one full bridge (for example OUT1A and OUT2A) are

connected in parallel, the peak current rating is not increased since the total current must

still flow through one bond wire on the power supply or sense pin. In addition, the

overcurrent detection senses the sum of the current in the upper devices of each bridge (A

or B), so connecting the two halves of one bridge in parallel does not increase the

overcurrent detection threshold.

Figure 29.

VS and SENSE pins maximum sourced current handling

Figure 30.

VS and SENSE pins maximum sinked current handling

AN2836 bảng dữ liệu(PDF) 29 Page - STMicroelectronics