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E28F002BVB80 bảng dữ liệu(PDF) 29 Page - Intel Corporation |
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E28F002BVB80 bảng dữ liệu(HTML) 29 Page - Intel Corporation |
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29 / 55 page ![]() E 2-MBIT SmartVoltage BOOT BLOCK FAMILY 29 SEE NEW DESIGN RECOMMENDATIONS 4.2.1 APPLYING VCC VOLTAGES When applying VCC voltage to the device, a delay may be required before initiating device operation, depending on the VCC ramp rate. If VCC ramps slower than 1V/100 µs (0.01 V/µs) then no delay is required. If VCC ramps faster than 1V/100 µs (0.01 V/µs), then a delay of 2 µs is required before initiating device operation. RP# = GND is recommended during power-up to protect against spurious write signals when VCC is between VLKO and VCCMIN. VCC Ramp Rate Required Timing ≤ 1V/100 µs No delay required. > 1V/100 µs A delay time of 2 µs is required before any device operation is initiated, including read operations, command writes, program operations, and erase operations. This delay is measured beginning from the time VCC reaches VCCMIN (3.0 V for 3.3 ± 0.3 V operation; and 4.5 V for 5 V operation). NOTES: 1. These requirements must be strictly followed to guarantee all other read and write specifications. 2. To switch between 3.3 V and 5 V operation, the system should first transition VCC from the existing voltage range to GND, and then to the new voltage. Any time the VCC supply drops below VCCMIN, the chip may be reset, aborting any operations pending or in progress. 3. These guidelines must be followed for any VCC transition from GND. 4.3 Capacitance TA = 25 °C, f = 1 MHz Symbol Parameter Note Typ Max Unit Conditions CIN Input Capacitance 1 6 8 pF VIN = 0 V COUT Output Capacitance 1, 2 10 12 pF VOUT = 0 V NOTES: 1. Sampled, not 100% tested. 2. For the 28F002B, address pin A10 follows the COUT capacitance numbers. |
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