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MPC826XAVV bảng dữ liệu(PDF) 8 Page - Freescale Semiconductor, Inc |
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MPC826XAVV bảng dữ liệu(HTML) 8 Page - Freescale Semiconductor, Inc |
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8 / 50 page ![]() MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 2.0 8 Freescale Semiconductor Electrical and Thermal Characteristics Table 2 lists recommended operational voltage conditions. NOTE: Core, PLL, and I/O Supply Voltages VDDH, VCCSYN, and VDD must track each other and both must vary in the same direction—in the positive direction (+5% and +0.1 Vdc) or in the negative direction (–5% and –0.1 Vdc). This device contains circuitry protecting against damage due to high static voltage or electrical fields; however, it is advised that normal precautions be taken to avoid application of any voltages higher than maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate logic voltage level (either GND or VCC). Figure 2 shows the undershoot and overshoot voltage of the 60x and local bus memory interface of the MPC8280. Note that in PCI mode the I/O interface is different. Figure 2. Overshoot/Undershoot Voltage Table 2. Recommended Operating Conditions1 1 Caution: These are the recommended and tested operating conditions. Proper device operating outside of these conditions is not guaranteed. Rating Symbol Value Unit Core supply voltage VDD 1.7 – 1.92 2 CPU frequency less than or equal to 200 MHz. 1.7–2.13 3 CPU frequency greater than 200 MHz but less than 233 MHz. 1.9 –2.24 4 CPU frequency greater than or equal to 233 MHz. V PLL supply voltage VCCSYN 1.7 – 1.92 1.7–2.13 1.9–2.24 V I/O supply voltage VDDH 3.135 – 3.465 V Input voltage VIN GND (–0.3) – 3.465 V Junction temperature (maximum) Tj 1055 5 Note that for extended temperature parts the range is (-40) TA – 105Tj. °C Ambient temperature TA 0–705 °C GND GND – 0.3 V GND – 1.0 V Not to exceed 10% GVDD of tSDRAM_CLK GVDD + 5% 4 V VIH VIL |
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