07XSC200 datasheet(6/51 Pages) FREESCALE

tên linh kiện	07XSC200

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Analog Integrated Circuit Device Data



Freescale Semiconductor

07XSC200

THERMAL RATINGS

Operating Temperature

• Ambient

• Junction (5)

-40 to 125

-40 to 150

C

Storage Temperature

TSTG

-55 to 150

C

THERMAL RESISTANCE

Thermal Resistance

• Junction to Case

• Junction to Ambient(6)

RJC

RJA

4.0

C/W

Peak Pin Reflow Temperature During Solder Mounting(7)

TSOLDER

260

C

Notes

To achieve high reliability over 10 years of continuous operation, the device's continuous operating junction temperature should not

exceed 125

C.

Device mounted on a 2s2p test board per JEDEC JESD51-2. 20 °C/W of RθJA can be reached in a real application case (4 layers board).

Pin soldering temperature limit is for 40 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

Table 2. Maximum Ratings (continued)

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent

damage to the device.

Ratings

Symbol

Value

Unit

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