AD9266-80EBZ datasheet(9/32 Pages) AD

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Data Sheet

AD9266

Rev. A | Page 9 of 32

ABSOLUTE MAXIMUM RATINGS

Table 6.

Parameter

Rating

AVDD to AGND

−0.3 V to +2.0 V

DRVDD to AGND

−0.3 V to +3.9 V

VIN+, VIN− to AGND

−0.3 V to AVDD + 0.2 V

CLK+, CLK− to AGND

−0.3 V to AVDD + 0.2 V

VREF to AGND

−0.3 V to AVDD + 0.2 V

SENSE to AGND

−0.3 V to AVDD + 0.2 V

VCM to AGND

−0.3 V to AVDD + 0.2 V

RBIAS to AGND

−0.3 V to AVDD + 0.2 V

CSB to AGND

−0.3 V to DRVDD + 0.3 V

SCLK/DFS to AGND

−0.3 V to DRVDD + 0.3 V

SDIO/PDWN to AGND

−0.3 V to DRVDD + 0.3 V

MODE/OR to AGND

−0.3 V to DRVDD + 0.3 V

D1_D0 Through D15_D14 to AGND

−0.3 V to DRVDD + 0.3 V

DCO to AGND

−0.3 V to DRVDD + 0.3 V

Operating Temperature Range (Ambient)

−40°C to +85°C

Maximum Junction Temperature Under Bias

150°C

Storage Temperature Range (Ambient)

−65°C to +150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL CHARACTERISTICS

The exposed paddle is the only ground connection for the chip.

The exposed paddle must be soldered to the AGND plane of the

user’s circuit board. Soldering the exposed paddle to the user’s

board also increases the reliability of the solder joints and

maximizes the thermal capability of the package.

Table 7. Thermal Resistance

Package

Type

Airflow

Velocity

(m/sec)

θJA1, 2

θJC1, 3

θJB1, 4

ΨJT1, 2

Unit

32-Lead LFCSP

5 mm × 5 mm

37.1

3.1

20.7

0.3

°C/W

1.0

32.4

0.5

°C/W

2.5

29.1

0.8

°C/W

Per JEDEC 51-7, plus JEDEC 51-5 2S2P test board.

Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).

Per MIL-Std 883, Method 1012.1.

Per JEDEC JESD51-8 (still air).

Typical θJA is specified for a 4-layer PCB with a solid ground

plane. As shown in Table 7, airflow improves heat dissipation,

which reduces θJA. In addition, metal in direct contact with the

package leads from metal traces, through holes, ground, and

power planes reduces the θJA.

ESD CAUTION

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