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MPC8323E bảng dữ liệu(PDF) 49 Page - Freescale Semiconductor, Inc

tên linh kiện MPC8323E
Giải thích chi tiết về linh kiện  PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications
PDF  82 Pages
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nhà sản xuất  FREESCALE [Freescale Semiconductor, Inc]
Trang chủ  http://www.freescale.com
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MPC8323E bảng dữ liệu(HTML) 49 Page - Freescale Semiconductor, Inc

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MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4
Freescale Semiconductor
49
Package and Pin Listings
21 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8323E is available in
a thermally enhanced Plastic Ball Grid Array (PBGA); see Section 21.1, “Package Parameters for the
MPC8323E PBGA,” and Section 21.2, “Mechanical Dimensions of the MPC8323E PBGA,” for
information on the PBGA.
21.1
Package Parameters for the MPC8323E PBGA
The package parameters are as provided in the following list. The package type is 27 mm
× 27 mm, 516
PBGA.
Package outline
27 mm
× 27 mm
Interconnects
516
Pitch
1.00 mm
Module height (typical)
2.25 mm
Solder Balls
62 Sn/36 Pb/2 Ag (ZQ package)
95.5 Sn/0.5 Cu/4Ag (VR package)
Ball diameter (typical)
0.6 mm
21.2
Mechanical Dimensions of the MPC8323E PBGA
Figure 42 shows the mechanical dimensions and bottom surface nomenclature of the MPC8323E,
516-PBGA package.



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