• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.

C31E.pdf

Mar.28,2011

181

PLp Chip Common Mode Choke Coil

Soldering and Mounting

3. Standard Soldering Conditions

(1) Soldering Methods

Use reflow soldering methods only.

In cases where several different parts are soldered, each

having different soldering conditions, use those

conditions requiring the least heat and minimum time.

Solder: Use Sn-3.0Ag-0.5Cu solder. Use of Sn-Zn based

solder will deteriorate performance of products.

Flux:

o Use Rosin-based flux.

use Rosin-based flux.

o Do not use strong acidic flux (with chlorine content

exceeding 0.20wt%)

o Do not use water-soluble flux.

For additional mounting methods, please contact Murata.

(2) Soldering Profile

oReflow Soldering Profile

(Sn-3.0Ag-0.5Cu Solder)

PLT10H

Series

Standard Profile

Limit Profile

Temp. (T1)

Time. (t1)

Heating

220

°C min. 30 to 60s

250

±3°C

2 times

max.

230

°C min.

260

°C/10s

2 times

max.

60s max.

Cycle

of Reflow

Peak

Temperature

(T2)

Temp. (T3)

Time. (t2)

Heating

Cycle

of Reflow

Peak

Temperature

(T4)

150

180

T2

T4

T3

T1

90s

±30s

time (s)

t2

t1

Limit Profile

Standard Profile

Pre-heating

(3) Reworking with Solder Iron

The following conditions must be strictly followed when

using a soldering iron.

Pre-heating: 150

°C 60s min.

Soldering iron power output / Tip diameter:

80W max. / ø3mm max.

Temperature of soldering iron tip / Soldering time / Times:

400

°C max. / 5s / 2 times

Do not allow the tip of the soldering iron to directly

contact the chip.

For additional methods of reworking with a soldering iron,

please contact Murata engineering.

Do not clean after soldering. If cleaning, please contact us.

4. Cleaning