• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.

C31E.pdf

Mar.28,2011

180

1. Standard Land Pattern Dimensions

Soldering and Mounting

Chip Common Mode Choke Coil

PLT10H

oReflow Soldering

(in mm)

2. Solder Paste Printing and Adhesive Application

the following cream solder printing conditions.

If too much solder is applied, the chip will be prone to

damage by mechanical and thermal stress from the PCB

and may crack.

Standard land dimensions should be used for resist and

copper foil patterns.

apply the adhesive in accordance with the following

conditions.

If too much adhesive is applied, then it may overflow into

the land or termination areas and yield poor solderability.

In contrast, if insufficient adhesive is applied, or if the

adhesive is not sufficiently hardened, then the chip may

become detached during flow soldering process.

PLT10H

oGuideline of solder paste thickness:

150-200

µm: PLT10H

For the solder paste printing pattern, use standard land dimensions.

*Solderability is subject to reflow conditions and thermal conductivity. Please make sure that your

product has been evaluated in view of your specifications with our product being mounted to your

product.

Series

Solder Paste Printing

PCB should be designed so that products are not

subjected to the mechanical stress caused by warping

the board.

Poor example

Products should be located in the sideways direction

(Length: a<b) to the mechanical stress.

Good example

a

b

Copper Foil Pattern + Resist

Copper Foil Pattern

Resist

PLT10H

4.0

8.0

4.0