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PLT10HH501100PN bảng dữ liệu(PDF) 32 Page - Murata Manufacturing Co., Ltd.

tên linh kiện PLT10HH501100PN
Giải thích chi tiết về linh kiện  SMD/BLOCK Type EMI Suppression Filters
PDF  40 Pages
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nhà sản xuất  MURATA [Murata Manufacturing Co., Ltd.]
Trang chủ  http://www.murata.com
Logo MURATA - Murata Manufacturing Co., Ltd.

PLT10HH501100PN bảng dữ liệu(HTML) 32 Page - Murata Manufacturing Co., Ltd.

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!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
C31E.pdf
Mar.28,2011
179
DLp Chip Common Mode Choke Coil
Soldering and Mounting
(3) Reworking with Solder Iron
The following conditions must be strictly followed when
using a soldering iron.
Pre-heating: 150
°C 60s min.
Soldering iron power output / Tip diameter:
30W max. / ø3mm max.
Temperature of soldering iron tip / Soldering time / Times:
350
°C max. / 3-4s / 2 times*1
*
1 DLP0NS, DLP11S, DLP11T, DLP1ND, DLP2AD:
380
°C max. / 3-4s / 2 times
Do not allow the tip of the soldering iron to directly
contact the chip.
For additional methods of reworking with a soldering iron,
please contact Murata engineering.
Following conditions should be observed when cleaning
chip EMI filter.
(1) Cleaning Temperature: 60
°C max. (40°C max. for
alcohol type cleaner)
(2) Ultrasonic
Output: 20W/liter max.
Duration: 5 minutes max.
Frequency: 28 to 40kHz
(3) Cleaning agent
The following list of cleaning agents have been tested on
the individual components. Evaluation of final assembly
should be completed prior to production.
Do not clean DLW (except DLW21H) series.
Before cleaning, please contact Murata engineering.
(a) Alcohol cleaning agent
Isopropyl alcohol (IPA)
(b) Aqueous cleaning agent
Pine Alpha ST-100S
(4) Ensure that flux residue is completely removed.
Component should be thoroughly dried after aqueous
agent has been removed with deionized water.
4. Cleaning



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