AD5204BRUZ100-R7 datasheet(18/20 Pages) AD

18 / 20 page

AD5204/AD5206

Rev. C | Page 18 of 20

6.40 BSC

4.50

4.40

4.30

PIN 1

7.90

7.80

7.70

0.15

0.05

0.30

0.19

0.65

BSC

1.20

MAX

0.20

0.09

0.75

0.60

0.45

8°

0°

SEATING

PLANE

0.10 COPLANARITY

COMPLIANT TO JEDEC STANDARDS MO-153-AD

Figure 37. 24-Lead Thin Shrink Small Outline Package [TSSOP]

(RU-24)

Dimensions shown in millimeters

COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2

0.30

0.23

0.18

0.20 REF

0.80 MAX

0.65 TYP

0.05 MAX

0.02 NOM

12° MAX

1.00

0.85

0.80

SEATING

PLANE

COPLANARITY

0.08

0.50

0.40

0.30

3.50 REF

0.50

BSC

PIN 1

INDICATOR

TOP

VIEW

5.00

BSC SQ

4.75

BSC SQ

3.45

3.30 SQ

3.15

PIN 1

INDICATOR

0.60 MAX

0.25 MIN

EXPOSED

PAD

(BOTTOM VIEW)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 38. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

5 mm × 5 mm Body, Very Thin Quad

(CP-32-3)

Dimensions shown in millimeters

ORDERING GUIDE

Model1, 2

kΩ

Temperature Range

Package Description

Package Option

AD5204BN10

−40°C to +85°C

24-Lead Plastic Dual In-Line Package [PDIP]

N-24-1

AD5204BR10

−40°C to +85°C

24-Lead Standard Small Outline Package [SOIC_W]

RW-24

AD5204BR10-REEL

−40°C to +85°C

24-Lead Standard Small Outline Package [SOIC_W]

RW-24

AD5204BRZ10

−40°C to +85°C

24-Lead Standard Small Outline Package [SOIC_W]

RW-24

AD5204BRZ10-REEL

−40°C to +85°C

24-Lead Standard Small Outline Package [SOIC_W]

RW-24

AD5204BRU10

−40°C to +85°C

24-Lead Thin Shrink Small Outline Package [TSSOP]

RU-24

AD5204BRU10-REEL7

−40°C to +85°C

24-Lead Thin Shrink Small Outline Package [TSSOP]

RU-24

AD5204BRUZ10

−40°C to +85°C

24-Lead Thin Shrink Small Outline Package [TSSOP]

RU-24

AD5204BRUZ10-REEL7

−40°C to +85°C

24-Lead Thin Shrink Small Outline Package [TSSOP]

RU-24

AD5204BCPZ10-REEL

−40°C to +85°C

32-Lead Frame Chip Scale Package [LFCSP_VQ]

CP-32-3

AD5204BCPZ10-REEL7

−40°C to +85°C

32-Lead Frame Chip Scale Package [LFCSP_VQ]

CP-32-3

AD5204BN50

−40°C to +85°C

24-Lead Plastic Dual In-Line Package [PDIP]

N-24-1

AD5204BR50

−40°C to +85°C

24-Lead Standard Small Outline Package [SOIC_W]

RW-24

AD5204BR50-REEL

−40°C to +85°C

24-Lead Standard Small Outline Package [SOIC_W]

RW-24

AD5204BRZ50

−40°C to +85°C

24-Lead Standard Small Outline Package [SOIC_W]

RW-24

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