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công cụ tìm kiếm bảng dữ liệu linh kiện điện tử |
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công cụ tìm kiếm bảng dữ liệu linh kiện điện tử |
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OR2C04A bảng dữ liệu(PDF) 115 Page - List of Unclassifed Manufacturers |
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OR2C04A bảng dữ liệu(HTML) 115 Page - List of Unclassifed Manufacturers |
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115 / 192 page  Data Sheet June 1999 ORCA Series 2 FPGAs Lucent Technologies Inc. 115 L4 VDD VDD VDD VDD VDD VDD T23 VDD VDD VDD VDD VDD VDD T4 VDD VDD VDD VDD VDD VDD L11 VSS VSS VSS VSS VSS VSS—ETC L12 VSS VSS VSS VSS VSS VSS—ETC L13 VSS VSS VSS VSS VSS VSS—ETC L14 VSS VSS VSS VSS VSS VSS—ETC L15 VSS VSS VSS VSS VSS VSS—ETC L16 VSS VSS VSS VSS VSS VSS—ETC M11 VSS VSS VSS VSS VSS VSS—ETC M12 VSS VSS VSS VSS VSS VSS—ETC M13 VSS VSS VSS VSS VSS VSS—ETC M14 VSS VSS VSS VSS VSS VSS—ETC M15 VSS VSS VSS VSS VSS VSS—ETC M16 VSS VSS VSS VSS VSS VSS—ETC N11 VSS VSS VSS VSS VSS VSS—ETC N12 VSS VSS VSS VSS VSS VSS—ETC N13 VSS VSS VSS VSS VSS VSS—ETC N14 VSS VSS VSS VSS VSS VSS—ETC N15 VSS VSS VSS VSS VSS VSS—ETC N16 VSS VSS VSS VSS VSS VSS—ETC P11 VSS VSS VSS VSS VSS VSS—ETC P12 VSS VSS VSS VSS VSS VSS—ETC P13 VSS VSS VSS VSS VSS VSS—ETC P14 VSS VSS VSS VSS VSS VSS—ETC P15 VSS VSS VSS VSS VSS VSS—ETC P16 VSS VSS VSS VSS VSS VSS—ETC R11 VSS VSS VSS VSS VSS VSS—ETC R12 VSS VSS VSS VSS VSS VSS—ETC R13 VSS VSS VSS VSS VSS VSS—ETC R14 VSS VSS VSS VSS VSS VSS—ETC R15 VSS VSS VSS VSS VSS VSS—ETC R16 VSS VSS VSS VSS VSS VSS—ETC T11 VSS VSS VSS VSS VSS VSS—ETC T12 VSS VSS VSS VSS VSS VSS—ETC T13 VSS VSS VSS VSS VSS VSS—ETC T14 VSS VSS VSS VSS VSS VSS—ETC T15 VSS VSS VSS VSS VSS VSS—ETC T16 VSS VSS VSS VSS VSS VSS—ETC Pin Information (continued) Table 27. OR2C/2T10A, OR2C/2T12A, OR2C/2T15A/B, OR2C/2T26A, and OR2T40A/B 352-Pin PBGA Pinout (continued) Pin 2C/2T10A Pad 2C/2T12A Pad 2C/2T15A/B Pad 2C/2T26A Pad OR2T40A/B Pad Function Notes: The pins labeled I/O-VDD5 are user I/Os for the OR2CxxA and OR2TxxB series, but they are connected to VDD5 for the OR2TxxA series. The pins labeled VSS-ETC are the 6 x 6 array of thermal balls located at the center of the package. The balls can be attached to the ground plane of the board for enhanced thermal capability (see Table 29), or they can be left unconnected. |
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