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F28M36P63C2ZWTQ bảng dữ liệu(PDF) 4 Page - Texas Instruments |
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F28M36P63C2ZWTQ bảng dữ liệu(HTML) 4 Page - Texas Instruments |
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4 / 202 page ![]() F28M36P63B2, F28M36P63C2 F28M36P53B2, F28M36P53C2, F28M36P33B2, F28M36P33C2 SPRS825 – OCTOBER 2012 www.ti.com 1 F28M36x (Concerto™) MCUs ......................... 1 3.1 Pin Assignments .................................... 88 1.1 Features ............................................. 1 3.2 Terminal Functions ................................. 93 1.2 Description ........................................... 2 4 Device Operating Conditions ...................... 122 1.3 Functional Block Diagram ........................... 3 4.1 Absolute Maximum Ratings ....................... 122 2 Device Overview ........................................ 5 4.2 Recommended Operating Conditions ............. 122 2.1 Device Characteristics ............................... 6 4.3 Electrical Characteristics .......................... 123 2.2 Memory Maps ........................................ 8 5 Electrical Specifications ............................ 124 2.3 Master Subsystem .................................. 19 5.1 Current Consumption ............................. 124 2.4 Control Subsystem ................................. 25 5.2 Thermal Design Considerations .................. 125 2.5 Analog Subsystem .................................. 30 5.3 Timing Parameter Symbology ..................... 126 5.4 Clock Frequencies, Requirements, and 2.6 Master Subsystem NMIs ........................... 33 Characteristics .................................... 127 2.7 Control Subsystem NMIs ........................... 33 5.5 Power Sequencing ................................ 130 2.8 Resets .............................................. 35 6 Peripheral Information and Timings ............. 134 2.9 Internal Voltage Regulation and Monitoring ........ 40 6.1 Analog and Shared Peripherals ................... 134 2.10 Input Clocks and PLLs ............................. 44 6.2 Master Subsystem Peripherals .................... 162 2.11 Master Subsystem Clocking ........................ 54 6.3 Control Subsystem Peripherals ................... 177 2.12 Control Subsystem Clocking ....................... 57 7 Device and Documentation Support ............. 196 2.13 Analog Subsystem Clocking ....................... 60 7.1 Device Support .................................... 196 2.14 Shared Resources Clocking ........................ 60 7.2 Community Resources ............................ 197 2.15 Loss of Input Clock (NMI Watchdog Function) ..... 60 7.3 Trademarks ....................................... 198 2.16 GPIOs and Other Pins .............................. 62 8 Mechanical Packaging and Orderable 2.17 Emulation/JTAG .................................... 82 Information ............................................ 199 2.18 Code Security Module (CSM) ...................... 85 8.1 Thermal Data for Package ........................ 199 2.19 µCRC Module ...................................... 86 8.2 Packaging Information ............................ 199 3 Device Pins ............................................. 88 4 Contents Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback |
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