GENERAL PowerPAD DESIGN CONSIDERATIONS

DIE

SideView(a)

EndView(b)

BottomView(c)

DIE

Thermal

Pad

M0031-01

TLV4110-EP, TLV4111-EP

TLV4112-EP, TLV4113-EP

Note that, with an operational amplifier, a duty cycle of 70% often results in the op-amp sourcing current 70% of

the time and sinking current 30%; therefore, the equivalent dc current is still 0.84 times the continuous current

rating at a particular junction temperature.

The TLV411x is available in a thermally-enhanced PowerPAD family of packages. These packages are

constructed using a downset lead frame upon which the die is mounted [see Figure 30(a) and Figure 30(b)]. This

arrangement results in the lead frame being exposed as a thermal pad on the underside of the package [see

Figure 30(c)]. Because this thermal pad has direct thermal contact with the die, excellent thermal performance

can be achieved by providing a good thermal path away from the thermal pad.

The PowerPAD package allows for both assembly and thermal management in one manufacturing operation.

During the surface-mount solder operation (when the leads are being soldered), the thermal pad can also be

soldered to a copper area underneath the package. Through the use of thermal paths within this copper area,

heat can be conducted away from the package into either a ground plane or other heat-dissipating device.

The PowerPAD package represents a breakthrough in combining the small area and ease of assembly of

surface mount with the previously awkward mechanical methods of heat sinking.

Figure 30. Views of Thermally Enhanced DGN Package

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