TLV4113MDGQREP datasheet(2/25 Pages) TI1

2 / 25 page

IOH − High-Level Output Current − mA

2.0

2.1

2.2

2.3

2.4

2.5

2.6

2.7

2.8

2.9

3.0

100

150

200

250

300

G004

VDD = 3 V

TA = 705C

TA = 255C

TA = 05C

TA = −405C

TA = 1255C

IOL − Low-Level Output Current − mA

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

100

150

200

250

300

G005

VDD = 3 V

TA = 705C

TA = 255C

TA = −405C

TA = 05C

TA = 1255C

TLV4110-EP, TLV4111-EP

TLV4112-EP, TLV4113-EP

SGLS314D – JUNE 2006 – REVISED MAY 2008............................................................................................................................................................... www.ti.com

TLV4110 AND TLV4111 AVAILABLE OPTIONS

PACKAGED DEVICES

MSOP

SMALL OUTLINE (D)(1) (2)

SMALL OUTLINE

SYMBOL

(DGN)(1)

TLV4110MDREP(3)

TLV4110MDGNREP(3)

BTB

–55

°C to 125°C

TLV4111MDREP(3)

TLV4111MDGNREP(3)

BTC

(1)

The R designation indicates package is taped and reeled.

(2)

In the SOIC package, the maximum RMS output power is thermally limited to 350 mW; 700 mW peaks can be driven, as long as the

RMS value is less than 350 mW.

(3)

Product preview.

TLV4112 AND TLV4113 AVAILABLE OPTIONS

PACKAGED DEVICES

MSOP

SMALL OUTLINE

(D) (1) (2)

SYMBOL

(DGN)(1)

(DGQ)(1)

TLV4112MDREP(3)

TLV4112MDGNREP(3)

BTD

–

–55

°C to 125°C

TLV4113MDREP(3)

–

TLV4113MDGQREP

BTE

(1)

The R designation indicates package is taped and reeled.

(2)

In the SOIC package, the maximum RMS output power is thermally limited to 350 mW; 700 mW peaks can be driven, as long as the

RMS value is less than 350 mW.

(3)

Product preview.

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Product Folder Link(s): TLV4110-EP, TLV4111-EP TLV4112-EP, TLV4113-EP

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