AD9737ABBCZ datasheet(8/64 Pages) AD

8 / 64 page

AD9737A/AD9739A

Data Sheet

Rev. | Page 8 of 64

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

Rating

VDDA to VSSA

−0.3 V to +3.6 V

VDD33 to VSS

−0.3 V to +3.6 V

VDD to VSS

−0.3 V to +1.98 V

VDDC to VSSC

−0.3 V to +1.98 V

VSSA to VSS

−0.3 V to +0.3 V

VSSA to VSSC

−0.3 V to +0.3 V

VSS to VSSC

−0.3 V to +0.3 V

DACCLK_P, DACCLK_N to VSSC

−0.3 V to VDDC + 0.18 V

DCI, DCO to VSS

−0.3 V to VDD33 + 0.3 V

LVDS Data Inputs to VSS

−0.3 V to VDD33 + 0.3 V

IOUTP, IOUTN to VSSA

−1.0 V to VDDA + 0.3 V

I120, VREF to VSSA

−0.3 V to VDDA + 0.3 V

IRQ, CS, SCLK, SDO, SDIO, RESET to VSS

−0.3 V to VDD33 + 0.3 V

Junction Temperature

150°C

Storage Temperature Range

−65°C to +150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 6. Thermal Resistance

Package Type

θJA

θJC

Unit

160-Ball CSP_BGA

31.2

7.0

°C/W1

With no airflow movement.

ESD CAUTION

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