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L6226Q bảng dữ liệu(PDF) 23 Page - STMicroelectronics

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L6226Q
Output current capability and IC power dissipation
Doc ID 14335 Rev 5
23/29
7
Output current capability and IC power dissipation
In Figure 18 and Figure 19 are shown the approximate relation between the output current
and the IC power dissipation using PWM current control driving two loads, for two different
driving types:
One full bridge ON at a time (Figure 18) in which only one load at a time is energized.
Two full bridges ON at the same time (Figure 19) in which two loads at the same time
are energized.
For a given output current and driving type the power dissipated by the IC can be easily
evaluated, in order to establish which package should be used and how large must be the
on-board copper dissipating area to guarantee a safe operating junction temperature
(125 °C maximum).
Figure 18.
IC power dissipation vs output current with one full bridge ON at a time
Figure 19.
IC power dissipation vs output current with two full bridges ON at the
same time
No PW M
fSW = 3 0 kHz (slow decay)
Test Conditions:
Supply Voltage = 24V
I A
I B
IOUT
IOUT
ONE FULL BRIDGE ON AT A TIME
PD [W]
I OUT [A]
0
0.25 0.5 0.75 1
1.25 1.5
0
2
4
6
8
10
No PWM
fSW = 30 kHz (slow decay)
Test Conditions:
Supply Volt age =24 V
I A
I B
IOUT
IOUT
PD [W ]
I OUT [A ]
TWO FULL BRIDGES ON AT THE SAME TIME
0
0.25 0.5 0.75
1
1.25 1.5
0
2
4
6
8
10



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