PCF8531U2DA datasheet(6/51 Pages) NXP

tên linh kiện	PCF8531U2DA

Giải thích chi tiết về linh kiện	34 x 128 pixel matrix driver Single-chip LCD controller and driver

PDF	51 Pages

Scroll/Zoom	100%

nhà sản xuất	NXP [NXP Semiconductors]

Trang chủ	http://www.nxp.com

Logo

6 / 51 page

PCF8531

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 6 — 16 May 2011

6 of 51

NXP Semiconductors

PCF8531

34 x 128 pixel matrix driver

[1]

Die size including saw lane of 70

μm.

6.2 Pin description

Fig 4.

Chip dimensions

Table 4.

Bonding pad dimensions

Pad

Size

Unit

pad pitch (minimum)

μm

bump dimensions

× 90 × 17.5 (±3)

μm

wafer thickness (excluding bumps)

381

μm

die size L

× W

12.14

× 1.86[1]

001aag908

pitch

PCF8531

Table 5.

Bonding pad description

All x/y coordinates represent the position of the center of each pad with respect to the center

(x/y = 0) of the chip (see Figure 2).

Symbol

Pad

X (

μm)

Y (

μm)

Description

5973.6

−821.7

dummy

5969.5

823.4

5899.5

823.4

5829.5

823.4

5479.5

823.4

5409.5

823.4

5059.5

823.4

4989.5

823.4

4639.5

823.4

4569.5

823.4

4219.5

823.4

4149.5

823.4

3799.5

823.4

3729.5

823.4

OSC

3449.5

823.4

oscillator input

[1]

VLCDSENSE

3169.5

823.4

voltage multiplier regulation input (VLCD) [2]

PCF8531U2DA bảng dữ liệu(PDF) 6 Page - NXP Semiconductors

PCF8531U2DA bảng dữ liệu(HTML) 6 Page - NXP Semiconductors

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51

bảng dữ liệu tải về

Link URL