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PCF8531U2DA bảng dữ liệu(PDF) 46 Page - NXP Semiconductors |
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PCF8531U2DA bảng dữ liệu(HTML) 46 Page - NXP Semiconductors |
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46 / 51 page ![]() PCF8531 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 6 — 16 May 2011 46 of 51 NXP Semiconductors PCF8531 34 x 128 pixel matrix driver 19. Abbreviations The orientation of the IC in a pocket is indicated by the position of the IC type name on the die surface with respect to the chamfer on the upper left corner of the tray. Refer to the bonding pad location diagram (Figure 2) for the orientation and position of the type name on the die surface. Fig 35. Tray alignment mgs489 Table 19. Abbreviations Acronym Description CDM Charged Device Model CMOS Complementary Metal-Oxide Semiconductor COG Chip-On-Glass DDRAM Double Data Random Access Memory EMC ElectroMagnetic Compatibility ESD ElectroStatic Discharge HBM Human Body Model HV High Voltage IC Integrated Circuit ITO Indium Tin Oxide LCD Liquid Crystal Display LSB Least Significant Bit MM Machine Model MPU MicroProcessor Unit POR Power-On Reset RAM Random Access Memory RC Resistance-Capacitance TC Temperature Coefficient SCL Serial CLock line SDA Serial DAta line |
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