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Datasheet

Package Mechanical Specifications and Pin Information

Package Mechanical

Specifications and Pin

Information

The Celeron M processor will be available in 478-pin, Micro-FCPGA and 479-ball, Micro-

FCBGA packages. Different views of the Micro-FCPGA package are shown in Figure 7

through Figure 9. Package dimensions are shown in Figure 7. Different views of the

Micro-FCBGA package are shown in Figure 7 through Figure 9. Package dimensions are

shown in Table 8.

The Micro-FCBGA package may have capacitors placed in the area surrounding the die.

Because the die-side capacitors are electrically conductive, and only slightly shorter

than the die height, care should be taken to avoid contacting the capacitors with

electrically conductive materials. Doing so may short the capacitors, and possibly

damage the device or render it inactive. The use of an insulating material between the

capacitors and any thermal solution should be considered to prevent capacitor shorting.

NOTE: All dimensions in millimeters. Values shown for reference only. Refer to Table 12 for

details.

Figure 7.

Micro-FCPGA Package Top and Bottom Isometric Views

TOP VIEW

BOTTOM VIEW

LABEL

PACKAGE KEEPOUT

DIE

CAPACITOR AREA

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