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MB90F337 bảng dữ liệu(PDF) 44 Page - fujitsu semiconductor |
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MB90F337 bảng dữ liệu(HTML) 44 Page - fujitsu semiconductor |
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44 / 48 page ![]() MB90335 Series 44 DS07-13735-6E ■ PACKAGE DIMENSION Please check the latest package dimension at the following URL. http://edevice.fujitsu.com/package/en-search/ 64-pin plastic LQFP Lead pitch 0.65 mm Package width × package length 12.0 × 12.0 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.70 mm MAX Weight 0.47 g Code (Reference) P-LQFP64-12 ×12-0.65 64-pin plastic LQFP (FPT-64P-M23) (FPT-64P-M23) C 2003-2010 FUJITSU SEMICONDUCTOR LIMITED F64034S-c-1-3 0.65(.026) 0.10(.004) 1 16 17 32 49 64 33 48 *12.00±0.10(.472±.004)SQ 14.00±0.20(.551±.008)SQ INDEX 0.32±0.05 (.013±.002) M 0.13(.005) 0.145±0.055 (.0057±.0022) "A" .059 –.004 +.008 –0.10 +0.20 1.50 0~8° 0.25(.010) (Mounting height) 0.50±0.20 (.020±.008) 0.60±0.15 (.024±.006) 0.10±0.10 (.004±.004) Details of "A" part (Stand off) Dimensions in mm (inches). Note: The values in parentheses are reference values Note 1) * : These dimensions do not include resin protrusion. Note 2) Pins width and pins thickness include plating thickness. Note 3) Pins width do not include tie bar cutting remainder. |
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