UJA1076 datasheet(40/47 Pages) NXP

40 / 47 page

UJA1076_2

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Product data sheet

Rev. 02 — 27 May 2010

40 of 47

NXP Semiconductors

UJA1076

High-speed CAN core system basis chip

12. Package outline

Fig 18. Package outline SOT549-1 (HTSSOP32)

UNIT

cD(1)

E(2)

eHE

LLp

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

0.15

0.05

0.1

DIMENSIONS (mm are the original dimensions).

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

SOT549-1

03-04-07

05-11-02

w M

L p

detail X

exposed die pad side

(A3)

0.25

0.95

0.85

0.30

0.19

5.1

4.9

3.6

3.4

0.20

0.09

11.1

10.9

6.2

6.0

8.3

7.9

0.65

0.2

0.78

0.48

0.1

0.75

0.50

v M A

HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads;

body width 6.1 mm; lead pitch 0.65 mm; exposed die pad

SOT549-1

max.

1.1

2.5

5 mm

scale

pin 1 index

MO-153

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