TPA032D02

10-W STEREO CLASS-D AUDIO POWER AMPLIFIER

SLOS243A – DECEMBER 1999 – REVISED MARCH 2000

22

POST OFFICE BOX 655303

MECHANICAL DATA

DCA (R-PDSO-G**)

PowerPAD

™ PLASTIC SMALL-OUTLINE PACKAGE

0,25

0,50

0,75

0,15 NOM

Gage Plane

6,00

6,20

8,30

7,90

Thermal Pad

(See Note D)

64

17,10

56

14,10

Seating Plane

16,90

13,90

4073259/A 01/98

0,27

25

24

A

0,17

48 PINS SHOWN

48

1

48

DIM

PINS **

A MAX

A MIN

1,20 MAX

12,40

12,60

0,50

0,10

M

0,08

0

°–8°

0,05

0,15

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane.

This pad is electrically and thermally connected to the backside of the die and possibly selected leads.

E. Falls within JEDEC MO-153

PowerPAD is a trademark of Texas Instruments.