SH7713 datasheet(369/904 Pages) RENESAS

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Section 11 On-Chip Oscillation Circuits

Rev.1.50 Aug. 30, 2006 Page 329 of 860

REJ09B0288-0150

11.9

Notes on Board Design

When Using an External Crystal Resonator: Place the crystal resonator, capacitors CL1 and

CL2, and damping resistor R close to the EXTAL and XTAL pins. To prevent induction from

interfering with correct oscillation, use a common grounding point for the capacitors connected to

the resonator, and do not locate a wiring pattern near these components.

Note: The values for CL1, CL2, and the damping resistance should be determined after

consultation with the crystal manufacturer.

XTAL

EXTAL

This LSI

CL2

CL1

Avoid crossing

signal lines

Figure 11.4 Points for Attention when Using Crystal Resonator

Bypass Capacitors: Insert a laminated ceramic capacitor as a bypass capacitor for each Vss/VssQ

and Vcc/VccQ pair. Mount the bypass capacitors to the power supply pins, and use components

with a frequency characteristic suitable for the operating frequency of the LSI, as well as a suitable

capacitance value.

Pin assignments of HQFP2828-256 (FP-256G/GV)

Vss/VssQ and Vcc/VccQ pair of digital circuitry

3 and 4, 13 and 14, 15 and 16, 25 and 26, 35 and 36, 43 and 44, 49 and 50, 57 and 58, 72 and

73, 81 and 82, 83 and 84, 92 and 93, 99 and 100, 107 and 108, 113 and 114, 121 and 122, 136

and 137, 146 and 147, 148 and 149, 158 and 159, 167 and 168, 176 and 177, 185 and 186, 191

and 192, 206 and 207, 208 and 209, 221 and 222, 227 and 228, 235 and 236, 241 and 242

Vss/VssQ and Vcc/VccQ pair of the on-chip oscillator

193 and 196, 251 and 252, 253 and 254

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